Carrier for diffusion of silicon chip

The utility model provides a carrier for diffusion of silicon chips. The carrier comprises: positioning clamp grooves arranged on the carrier and used for positioning the silicon chips, wherein the width of a groove bottom of each positioning clamp groove is smaller than the width of an opening of each positioning clamp groove; and a spacing device which is equipped with stop silicon chips and spacing clamp grooves that match the positioning clamp grooves to make the two kinds of the silicon chips always tightly contact. During diffusion operation, the width of the groove bottom of each positioning clamp groove is smaller than the width of the opening of each positioning clamp groove, that is to say, the width of the groove bottom of the carrier is smaller compared with the width of a groove bottom of a conventional clamp groove, so that displacement moving spaces of the silicon chips under thermal stress are minimized and then edges of the silicon chips, placed on the groove bottoms can be better clamped and