Combined grinding wheel for silicon wafer chamfering machine

The utility model provides a combined grinding wheel for a silicon wafer chamfering machine. The combined grinding wheel for the silicon wafer chamfering machine comprises a wheel body and a plurality of mill grooves positioned in the periphery of the wheel. The number of the mill grooves is optimized as nine, wherein each edge cutting angle of four mill grooves is 39 degrees to 41 degrees, the circular arc radius of each bottom portion of the four mill grooves is 2.6mm to 3.0mm, each edge cutting angle of the other mill grooves is 21 degrees to 23 degrees, and the circular arc radius of each bottom portion of the other mill grooves is 2.2mm to 2.6mm. The depth of each mill groove is 1.00mm to 1.20mm, and the thickness of each brickbat contained by the mill grooves is 550 micrometers to 780 micrometers. Through reasonable design, the combined grinding wheel for the silicon wafer chamfering machine can achieve processing silicon wafers with different edge profiles without changing the grinding wheels, the work