LED packaging structure

The utility model provides an LED packaging structure which comprises a support. A transparent or semi-transparent die attach adhesive is arranged on the support; a wafer is attached on the die attach adhesive; a light refraction layer is arranged in the die attach adhesive. According to the utility model, light emitted from the bottom of the wafer is reflected into the die attach adhesive and is then refracted by a refraction bead to form an optical focus effect, so propagation direction of the light is changed and total reflection loss of the light is reduced; meanwhile, the refraction bead has a high heat conduction coefficient, so thermal resistance of the die attach adhesive is reduced, heat generated by the wafer during working can be rapidly radiated, and the service life of an LED device is prolonged.