Composite type ultra-thin double-sided copper foil substrate

The utility model discloses a composite type ultra-thin double-sided copper foil substrate. The composite type ultra-thin double-sided copper foil substrate of the utility model is composed of a first copper foil layer, a polyimide layer, an adhesion layer, and a second copper foil layer. The polyim...

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Bibliographische Detailangaben
Hauptverfasser:	ZANG BIAO, LIN ZHIMING, LI JIANHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	The utility model discloses a composite type ultra-thin double-sided copper foil substrate. The composite type ultra-thin double-sided copper foil substrate of the utility model is composed of a first copper foil layer, a polyimide layer, an adhesion layer, and a second copper foil layer. The polyimide layer is sandwiched between the adhesion layer and the first copper foil layer, the adhesion layer is sandwiched between the second copper foil layer and the polyimide layer, and the total thickness of the polyimide layer and the adhesion layer is in the range from 8 microns to 25 microns. According to the utility model, the composite type ultra-thin double-sided copper foil substrate of the utility model not only is light and thin and has advantages of high dimensional stability, high buckling performance and low bounce, and but also is formed through a coating process or a transfer printing process and a low-temperature pressing process, so advantages of simple manufacturing method, high yield and low cost ar