Semiconductor structure and packaging construction
The utility model relates to a semiconductor structure and a packaging construction. The semiconductor structure comprises a carrier and a plurality of button-shaped bumps, the carrier possesses a plurality of bump lower metal layers on which the button-shaped bumps are formed, each button-shaped bu...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model relates to a semiconductor structure and a packaging construction. The semiconductor structure comprises a carrier and a plurality of button-shaped bumps, the carrier possesses a plurality of bump lower metal layers on which the button-shaped bumps are formed, each button-shaped bump possesses a carrying part and a jointing part connected with the carrying part, and each carrying part possesses a carrying surface which possesses a first area and a second area, and each jointing part covers the first area of each carrying surface. |
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