Semiconductor structure

The utility model relates to a semiconductor structure, comprising a substrate and a plurality of hybrid bumps. The substrate possesses a plurality of bump lower metal layers on which the hybrid bumps are formed, and each hybrid bump possesses a carrying part and a guiding connecting part; each guid...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GUO ZHIMING, LIN GONGAN, HE RONGHUA, CHEN SHENGHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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