LED

The utility model discloses an LED. The LED comprises a chip substrate and an LED chip arranged on the chip substrate and further comprises at least one first printing glue layer which covers a luminescence face of the LED chip, wherein the first printing glue layer is the first fluorescent glue layer. The first fluorescent glue layer of the LED is printed on the luminescence face of the LED chip, and a fluorescent glue layer is formed by printing, so position of fluorescent powder at fluorescent glue is relatively fixed and not distributed randomly, and distribution at the fluorescent glue is more uniform than position distribution of fluorescent powder at fluorescent glue in the prior art, and thereby uniformity of LED luminescence color is improved, moreover, only arrangement of the fluorescent glue layer on the luminescence face of the LED chip is required, and the fluorescent glue is not filled in a whole chamber of the LED, so required fluorescent glue amount is less than that of packaging technology in