Package substrate having interposer, and package structure thereof

A package substrate having an interposer and a package structure thereof are provided. The package substrate comprises a substrate body and an interposer, wherein a first surface of the substrate body is provided with multiple first and second electric contact pads, and first conductive columns disposed on the second electric contact pads; the interposer comprises an interposer body, multiple through holes penetrate the interposer, and second conductive columns disposed in the through holes; each second conductive column has a protrusive portion protrudes from the bottom surface of the interposer; the interposer, through the protrusive portions, is electrically connected with the first electric contact pads; and the second electric contact pads are positioned on the periphery of the interposer. The package structure having an interposer comprises the package substrate, a semiconductor chip connected with and disposed on the interposer, and a package colloid which wraps the substrate body, the interposer and t