Non-contact silicon wafer metering device

The utility model discloses a non-contact silicon wafer metering device which comprises a detection platform and further comprises thickness test modules arranged above and below the detection platform, and resistivity test modules arranged above and below the detection platform and a terminal are respectively and electrically connected with the thickness test modules and the resistivity test modules. The metering device achieves simultaneous measurement of silicon wafer thickness and resistivity, greatly shortens measurement time, reduces equipment use and simultaneously reduces damage rate of a silicon wafer.