Semiconductor package substrate
The utility model relates to a semiconductor package substrate, which takes a conductive combined layer matching a conductive column as an external connection structure and can enable the height of each external connection structure to be equal so that each semiconductor package substrate does not g...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model relates to a semiconductor package substrate, which takes a conductive combined layer matching a conductive column as an external connection structure and can enable the height of each external connection structure to be equal so that each semiconductor package substrate does not generate problems of inclination, poor coplanarity and the like. |
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