Nail bed for simplifying rigid circuit board silkscreen solder resisting printing ink process
Disclosed is a nail bed for simplifying rigid circuit board silkscreen solder resisting printing ink process, comprising a backing plate and a plurality of tooling patches arranged upon the backing plate in a matrix manner, wherein each tooling patch is provided with a screw; and the lower end of th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Disclosed is a nail bed for simplifying rigid circuit board silkscreen solder resisting printing ink process, comprising a backing plate and a plurality of tooling patches arranged upon the backing plate in a matrix manner, wherein each tooling patch is provided with a screw; and the lower end of the screw penetrates the tooling patch to enter the backing plate. The nail bed of the utility model simplifies the process of making the solder resisting printing ink with the rigid circuit board, reduces the pre-sheet-baking frequency, reduces the probability of fault operation, saves the making cost, shortens the product-making period, solves the under developing of the solder resisting printing ink in term of quality, raises the product qualified rate, and substantially promotes the smooth production. |
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