Accompany-plating shunt bar for electroplating
The utility model discloses an accompany-plating shunt bar for electroplating, which is convenient to adjust and has a low probability of being dropped from a groove. The shunt bar is characterized by comprising a hook connected with one end of a strake lower plate (3), wherein fixing holes (5) for...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses an accompany-plating shunt bar for electroplating, which is convenient to adjust and has a low probability of being dropped from a groove. The shunt bar is characterized by comprising a hook connected with one end of a strake lower plate (3), wherein fixing holes (5) for mounting butterfly screws (2) are formed in the hook (1); and the hook (1) can be fastened on a copper bar of an electroplating target through the butterfly screws (2). The shunt bar has the advantages of simple structure and convenience in use, can be adjusted in length to be the same as a production product at any time, can be close to a circuit board, and ensures the product quality. Therefore, the shunt bar can be used for vertical plating lines in a cycled manner, and the product quality is ensured. |
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