Device for lowering facing slip glue overflow rate

The utility model discloses a device for lowering the facing slip glue overflow rate. The device comprises a glue applying wheel and more than one glue applying wafer, wherein the glue applying wafers are fixedly installed on the glue applying wheel, and the glue applying wafers on both sides are fa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HONG YUANHUA, MAI MENGQING, CHEN ZHIJIAN, LI CAIJIAN, ZHENG GUOHUA, CHEN NUBO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The utility model discloses a device for lowering the facing slip glue overflow rate. The device comprises a glue applying wheel and more than one glue applying wafer, wherein the glue applying wafers are fixedly installed on the glue applying wheel, and the glue applying wafers on both sides are fan-shaped glue applying wafers. In the utility model, the structure of the glue applying wheel is improved, the fan-shaped glue applying wafers are adopted on both sides, so that overflow glue of cigarette packets is obviously reduced, the electrical fault rate is lowered, and the machine stopping times and the packet waste rate are lowered.