Mold device used for cutting and molding in semiconductor packaging

The utility model provides a mold device used for cutting and molding in semiconductor packaging. The mole device includes a first trimming mole and a second trimming mold. The first trimming mold is provided with an edge ripping knife. Compared with the prior art, by adding the edge ripping knife in the first trimming mold, two side faces of resin adhered on an SOT-223 product is ripped from a connection part of a lead frame. The rest resin becomes loose after a first trimming and then is easy to be removed in an electrofacing resin removal process. Thus, the resin adhering condition is improved in a second trimming molding. At the same time, the time of each batch of products staying in a T/F station is shortened to 50 minutes, and the working efficiency is improved by 50 percents. Thus, the capacity and the quality are improved effectively. And the enterprise cost is reduced at the same time.