LED package and lead frame

The utility model provides an LED package and a lead frame. The LED package comprises a reflection cup provided with a bottom surface and a wall surface, wherein the wall surface is oblique relative to the bottom surface, the upper end of the wall surface is defined to be an opening, and the reflect...

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Bibliographische Detailangaben
Hauptverfasser:	H.LIU, D.EMERSON, Y.K.LIU, X.FEI, J.SHENG, C.K.CHEN, Z.ZHIKUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADVERTISING BASIC ELECTRIC ELEMENTS CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LABELS OR NAME-PLATES PHYSICS SEALS SEMICONDUCTOR DEVICES SIGNS
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Beschreibung
Zusammenfassung:	The utility model provides an LED package and a lead frame. The LED package comprises a reflection cup provided with a bottom surface and a wall surface, wherein the wall surface is oblique relative to the bottom surface, the upper end of the wall surface is defined to be an opening, and the reflection cup is oval or circular; and LEDs arranged on the bottom surface, wherein the bottom surface is provided with a first axial dimension from 0.91 mm to 1.1 mm along a first axis and a second axial dimension from 0.66 mm to 0.91 mm along a second axis perpendicular to the first axis. The lead frame comprises the reflection cup provided with the bottom surface and the wall surface, wherein the wall surface is oblique relative to the bottom surface, the upper end of the wall surface is defined to be an opening, the reflection cup is oval or circular, and the bottom surface is provided with the first axial dimension from 0.91 mm to 1.1 mm along the first axis and the second axial dimension from 72% to 100% of the fir