Silicon wafer cutting equipment

The utility model provides silicon wafer cutting equipment which comprises a fixing device for fixing silicon materials, wherein, a cutting device arranged below the fixing device comprises cutting steel wires wound on a roll shaft; two silicon blocks are mounted on the fixing device side by side; and a line distributing wheel is arranged on one side of the joint part of the two silicon blocks. The silicon wafer cutting equipment has the advantages that the wafer yield is high when the same silicon materials are used, the production efficiency is high, the unit cost of a silicon wafer is low, and the production process is simple.