Compound plate for packing

The utility model discloses a compound plate for packing, which comprises a substrate, wherein the substrate is compounded with a bonding layer for bonding. The compound plate has the technical advantages that: 1, the procedure is simplified, and convenience, practicability, high efficiency and rapi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	HAN SHENGXIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The utility model discloses a compound plate for packing, which comprises a substrate, wherein the substrate is compounded with a bonding layer for bonding. The compound plate has the technical advantages that: 1, the procedure is simplified, and convenience, practicability, high efficiency and rapidness are realized; 2, the compound plate is clean and environmentally-friendly, and has low defective product rate and lower waste; 3, a bonding surface is fixedly sealed into a whole after thermal bonding and cooling, so the bonding fastness is strong; 4, a plastic film layer is formed on the surface of the substrate, so that the material intensity is enhanced, and waterproofness and heat preservation are realized; and 5, resin is taken as a bonding material, so that the compound plate is environmentally-friendly.