Metal base copper-clad plate with low thermal resistance and high insulation property

The utility model discloses a metal base copper-clad plate with low thermal resistance and high insulation property, wherein the metal base copper-clad plate comprises an electric conduction metal layer copper foil; a heat conduction polyimide layer is coated on the electric conduction metal layer c...

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Bibliographische Detailangaben
Hauptverfasser:	LIU XI, LI GUOFA, ZHANG JIAJI, LIU PEIRAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The utility model discloses a metal base copper-clad plate with low thermal resistance and high insulation property, wherein the metal base copper-clad plate comprises an electric conduction metal layer copper foil; a heat conduction polyimide layer is coated on the electric conduction metal layer copper foil; a heat conduction adhesive layer is coated on the heat conduction polyimide layer; and a heat dissipation metal layer is pressed on the heat conduction adhesive layer. The utility model aims at overcoming the defects in the prior art and providing a metal base copper-clad plate with lower cost, lower thermal resistance and good insulation property. The metal base copper-clad plate of the utility model has the characteristics of being low in thermal resistance, high in insulation property and thin and has excellent heat resistance, fire resistance and high peel strength.