Compound model-free heat insulation device for heat insulation of wall
The utility model relates to an outer heat insulation device for a building outer wall, in particular to a compound model-free heat insulation device for heat insulation of a wall and solves the problems that the process is complex, the construction period is long, the comprehensive construction cos...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to an outer heat insulation device for a building outer wall, in particular to a compound model-free heat insulation device for heat insulation of a wall and solves the problems that the process is complex, the construction period is long, the comprehensive construction cost is high, the engineering quality cannot be guaranteed and the like during the construction of the conventional heat insulation plate. The outer heat insulation device comprises heat insulation plate bodies, and prefabrication fire protection insulating band plates which are distributed between heat insulation plate bodies; the upper surface layer and the lower surface layer of each heat insulation plate body are provided with elongated grooves; steel mesh sheets are erected on the upper surface layer of each heat insulation plate body; protective coatings which are higher the steel mesh sheets are coated on the upper surface layer and the grooves of each heat insulation plate body; each prefabrication fire protec |
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