Copper wire plating device

Copper wire plating device

The utility model discloses a copper wire plating device, which comprises a support frame, wherein slide rails are arranged on upright posts arranged at both sides of the support frame, a plating bath is arranged under the support frame, material frames are glidingly arranged on the slide rails arra...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: YUAN DAOXING
Format: Patent
Sprache:chi ; eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:The utility model discloses a copper wire plating device, which comprises a support frame, wherein slide rails are arranged on upright posts arranged at both sides of the support frame, a plating bath is arranged under the support frame, material frames are glidingly arranged on the slide rails arranged at both sides of the support frame, both ends of the material frames are provided with pulleys matched with the slide rails, and the upper end of the material frames is connected with a hoisting belt. The utility model has simple structure, improves the copper wire plating efficiency, is convenient to manufacture and is applicable to the large-scale copper wire plating.