Multi-layer packaging structure

The utility model discloses a multi-layer packaging structure. The multi-layer packaging structure contains a bottom layer, a middle layer and a film layer, wherein the middle layer is provided with a perforation and is attached to the bottom layer, and a flat plate-shaped device is contained in the...

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Bibliographische Detailangaben
Hauptverfasser:	XIAO FENGJI, YANG KUNSHAN, LIN DONGFU, YANG YIXUE, LI ZHIWEI, ZHENG QINGFEN, XU GUOYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TELEPHONIC COMMUNICATION TRANSPORTING
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Beschreibung
Zusammenfassung:	The utility model discloses a multi-layer packaging structure. The multi-layer packaging structure contains a bottom layer, a middle layer and a film layer, wherein the middle layer is provided with a perforation and is attached to the bottom layer, and a flat plate-shaped device is contained in the perforation; and the film layer is adhered to the middle layer. The profile of the periphery of the perforation conforms to the profile of the periphery of the flat plate-shaped device, and the thickness of the flat plate-shaped device is not greater than the thickness of the middle layer. The multi-layer packaging structure has convenience and can substantially protect a signal processing device.