Electroplating aid for lead frame of quad flat no-lead (QFN) packaging structure

The utility model relates to an integrated circuit chips processing device, in particular to an electroplating aid for a lead frame of a QFN packaging structure. The electroplating aid is arranged below the mechanical pressing plate of an electroplating machine. The electroplating aid is formed by an anticorrosive bottom plate, a steel plate, an anticorrosive substrate and shutters which are sequentially stacked up from bottom to top. Lead frame panels are placed on the shutters for electroplating operation. Through holes are arranged on the anticorrosive bottom plate, the steel plate and the anticorrosive substrate at positions corresponding to all unit windows of the lead frame panels. The shutters are divided into two groups which are respectively provided with staggered through holes which correspond to the array-arranged unit windows. The anode of the electroplating machine is electrically connected to the steel plate. A cover plate is connected below the mechanical pressing plate. A probe is inserted in