Fully-automatic electronic component production line
The utility model relates to a fully-automatic electronic component production line, which comprises a wire bonder, a packaging machine, a curing oven, a testing machine and a wrapping machine, wherein the wire bonder is used for connecting an electronic component substrate to a material belt in ser...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model relates to a fully-automatic electronic component production line, which comprises a wire bonder, a packaging machine, a curing oven, a testing machine and a wrapping machine, wherein the wire bonder is used for connecting an electronic component substrate to a material belt in series, the packaging machine is used for packaging the electronic component substrate, the curing oven is used for curing a packaged electronic component, the testing machine is used for testing the electronic component, the curing oven is provided with an inlet and an outlet for a material belt to penetrate in and out, a cushioning device for adjusting the transmission speed of the material belt and increasing the transmission path of the material belt is arranged in the curing oven, and the material belt sequentially passes through the wire bonder, the packaging machine, the inlet of the curing oven, the cushioning device of the curing oven, the outlet of the curing oven, the testing machine and the wrapping machin |
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