Grounding detecting system of multi-wire slicon wafer cutter and detection electrode of grounding detecting system

The utility model discloses a detection electrode which is used for a grounding detecting system of a multi-wire slicon wafer cutter and comprises electrode stems and support plates positioned at two ends of each electrode stem, wherein two electrode stems, which are vertically arranged at intervals and are parallel to each other, are arranged between the support plates and connected in series with each other on a circuit. The detection electrode can fix the upper and the lower metal electrode stems at the same time, a wire mesh can pass through the space between the two metal electrode stems, and the two metal electrode stems clamp the wire mesh therebetween, so that the contact probability of a steel wire and the metal electrode stems after the wire mesh is broken is increased, the detection is more sensitive, and the problem of the loss caused by wire breakage in the multi-wire cutter can be fundamentally solved. The utility model further discloses a grounding detecting system of a multi-wire slicon wafer