Highly-effective energy-saving semiconductor plastic-encapsulated mold

The utility model discloses a highly-effective energy-saving semiconductor plastic-encapsulated mold, wherein an upper center running channel plate of an upper mold box (8) and a lower center runningchannel plate of a lower mold box (9) can form a sealed cavity, the upper mold box (8) and the lower...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU MINGHUA, ZOU XUEBIN, YUAN WEI, LIU XIANGDONG, XIONG SHUNING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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