Highly-effective energy-saving semiconductor plastic-encapsulated mold

The utility model discloses a highly-effective energy-saving semiconductor plastic-encapsulated mold, wherein an upper center running channel plate of an upper mold box (8) and a lower center runningchannel plate of a lower mold box (9) can form a sealed cavity, the upper mold box (8) and the lower mold box (9) are both provided with adhesive channels (24), the adhesive channels (24) are hollow pipelines, and are communicated with a flow passage (25), the adhesive channels (24) are communicated with an integrated component hole (26), an injection molding head (4) is communicated with the cavity, and fluid resin in a charging cylinder (31) is charged by the injection molding head through the adhesive channels (24) and the flow passage (25). The utility model overcomes the weaknesses that the running channel process is long, the gas tightness of plastic-encapsulated products is poor, and the replacements of inserts and top bar are complicated in the prior art, provides a semiconductor plastic-encapsulated mold