Wafer suction disc apparatus for test bench

The utility model relates to wafer testing equipment, in particular to a wafer adhesive disc device of a test bench for realizing the fixing of the wafer in testing in a negative pressure adsorption mode. According to the technical proposal of the utility model, a heater is arranged between a negative pressure adhesive disc and a heat insulation disc; a plurality of negative pressure air grooves are arranged on the upper surface of the negative pressure adhesive disc; the inside of the negative pressure adhesive disc is provided with negative pressure air holes communicated with the negative pressure air grooves; a negative pressure windpipe joint is arranged on the negative pressure adhesive disc and is communicated with the negative pressure air holes; and a discharge hole running through the negative pressure adhesive disc, the heater and the heat insulation disc is arranged on the negative pressure adhesive disc. In use, the wafer is convenient to fix and detach, and the wafer adhesive device can greatly