Light-emitting diode chip, side injection type backlight die set and directly-down backlight die set
The utility model relates to an LED chip, which includes a reflecting layer, a first-type semiconductor layer, an active layer, a second-type semiconductor layer, a first electrode layer, a second electrode layer and a light-screening device, wherein the first-type semiconductor layer is arranged on...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to an LED chip, which includes a reflecting layer, a first-type semiconductor layer, an active layer, a second-type semiconductor layer, a first electrode layer, a second electrode layer and a light-screening device, wherein the first-type semiconductor layer is arranged on the reflecting layer while the active layer is arranged between the first-type semiconductor layer and the second-type semiconductor layer; furthermore, the first electrode layer is electrically connected with the first-type semiconductor layer and the second electrode layer is arranged on the second-type semiconductor layer; in addition, the light-screening device is arranged on the second electrode layer and can reflect the rays with the wavelengths ranged from 450nm to 525nm to provide the LED chip with high-purity light source. |
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