High-performance internal storage test module

High-performance internal storage test module

The utility model relates to a high-efficiency memory test module, which is used for testing a ball grid array packing unit and at least comprises a support plate; at least more than one piece of conducting rubber is arranged on the support plate and fixed on a circuit board; a case box is lapped an...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: CAI YIXIU
Format: Patent
Sprache:chi ; eng
Schlagworte:
INFORMATION STORAGE
PHYSICS
STATIC STORES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CAI YIXIU
description The utility model relates to a high-efficiency memory test module, which is used for testing a ball grid array packing unit and at least comprises a support plate; at least more than one piece of conducting rubber is arranged on the support plate and fixed on a circuit board; a case box is lapped and arranged above the support plate and fixed on the circuit board; a positioning frame is contained in the case body and provided with at least more than one holding space used for holding the ball grid array packing unit. A plurality of ball pins on the unit are conducted by the corresponding connection of a plurality of pieces of conducting rubber (or a plurality of spring conductors) on the support plate and a plurality of ball pins on the circuit board, which achieves the test structure of the ball grid array packing unit that reduces cost and improves testing efficiency.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN201111933YY</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN201111933YY</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN201111933YY3</originalsourceid><addsrcrecordid>eNrjZND1yEzP0C1ILUrLL8pNzEtOVcjMK0ktykvMUSguyS9KTE9VKEktLlHIzU8pzUnlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GBoZAYGlsHBlpTJQiAD1zKzk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>High-performance internal storage test module</title><source>esp@cenet</source><creator>CAI YIXIU</creator><creatorcontrib>CAI YIXIU</creatorcontrib><description>The utility model relates to a high-efficiency memory test module, which is used for testing a ball grid array packing unit and at least comprises a support plate; at least more than one piece of conducting rubber is arranged on the support plate and fixed on a circuit board; a case box is lapped and arranged above the support plate and fixed on the circuit board; a positioning frame is contained in the case body and provided with at least more than one holding space used for holding the ball grid array packing unit. A plurality of ball pins on the unit are conducted by the corresponding connection of a plurality of pieces of conducting rubber (or a plurality of spring conductors) on the support plate and a plurality of ball pins on the circuit board, which achieves the test structure of the ball grid array packing unit that reduces cost and improves testing efficiency.</description><language>chi ; eng</language><subject>INFORMATION STORAGE ; PHYSICS ; STATIC STORES</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20080910&amp;DB=EPODOC&amp;CC=CN&amp;NR=201111933Y$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20080910&amp;DB=EPODOC&amp;CC=CN&amp;NR=201111933Y$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CAI YIXIU</creatorcontrib><title>High-performance internal storage test module</title><description>The utility model relates to a high-efficiency memory test module, which is used for testing a ball grid array packing unit and at least comprises a support plate; at least more than one piece of conducting rubber is arranged on the support plate and fixed on a circuit board; a case box is lapped and arranged above the support plate and fixed on the circuit board; a positioning frame is contained in the case body and provided with at least more than one holding space used for holding the ball grid array packing unit. A plurality of ball pins on the unit are conducted by the corresponding connection of a plurality of pieces of conducting rubber (or a plurality of spring conductors) on the support plate and a plurality of ball pins on the circuit board, which achieves the test structure of the ball grid array packing unit that reduces cost and improves testing efficiency.</description><subject>INFORMATION STORAGE</subject><subject>PHYSICS</subject><subject>STATIC STORES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND1yEzP0C1ILUrLL8pNzEtOVcjMK0ktykvMUSguyS9KTE9VKEktLlHIzU8pzUnlYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxzn5GBoZAYGlsHBlpTJQiAD1zKzk</recordid><startdate>20080910</startdate><enddate>20080910</enddate><creator>CAI YIXIU</creator><scope>EVB</scope></search><sort><creationdate>20080910</creationdate><title>High-performance internal storage test module</title><author>CAI YIXIU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN201111933YY3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2008</creationdate><topic>INFORMATION STORAGE</topic><topic>PHYSICS</topic><topic>STATIC STORES</topic><toplevel>online_resources</toplevel><creatorcontrib>CAI YIXIU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CAI YIXIU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High-performance internal storage test module</title><date>2008-09-10</date><risdate>2008</risdate><abstract>The utility model relates to a high-efficiency memory test module, which is used for testing a ball grid array packing unit and at least comprises a support plate; at least more than one piece of conducting rubber is arranged on the support plate and fixed on a circuit board; a case box is lapped and arranged above the support plate and fixed on the circuit board; a positioning frame is contained in the case body and provided with at least more than one holding space used for holding the ball grid array packing unit. A plurality of ball pins on the unit are conducted by the corresponding connection of a plurality of pieces of conducting rubber (or a plurality of spring conductors) on the support plate and a plurality of ball pins on the circuit board, which achieves the test structure of the ball grid array packing unit that reduces cost and improves testing efficiency.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN201111933YY
source esp@cenet
subjects INFORMATION STORAGE
PHYSICS
STATIC STORES
title High-performance internal storage test module
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T07%3A13%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CAI%20YIXIU&rft.date=2008-09-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN201111933YY%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true