High-performance internal storage test module

The utility model relates to a high-efficiency memory test module, which is used for testing a ball grid array packing unit and at least comprises a support plate; at least more than one piece of conducting rubber is arranged on the support plate and fixed on a circuit board; a case box is lapped and arranged above the support plate and fixed on the circuit board; a positioning frame is contained in the case body and provided with at least more than one holding space used for holding the ball grid array packing unit. A plurality of ball pins on the unit are conducted by the corresponding connection of a plurality of pieces of conducting rubber (or a plurality of spring conductors) on the support plate and a plurality of ball pins on the circuit board, which achieves the test structure of the ball grid array packing unit that reduces cost and improves testing efficiency.