Packaging structure and method for fabricating the same
A packaging manufacturing method includes the following steps. Firstly, provide a first substrate and a second substrate, in which the first substrate has a number of the first contact points, and the second substrate has a number of the second contact points. Following, place the first substrate on...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A packaging manufacturing method includes the following steps. Firstly, provide a first substrate and a second substrate, in which the first substrate has a number of the first contact points, and the second substrate has a number of the second contact points. Following, place the first substrate on the second substrate, so that the first contact points align to the second contact points. Then, immerse the first and second substrate in a solution containing 1, 4-dimethoxy-phenyl mercaptan BDMT. Then remove the first and the second substrate from the solution, in order that between the first contact points and the second contact points, to form a number of self-assembled monolayer film connecting with the first contact points and the second contact points. In addition, the invention also provides a package structure formed by the said packaging manufacturing process. |
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