Method and apparatus for separating wafer as a disk made of fragile materials

The invention is directed to a method in which disks, particularly wafers, of brittle material are severed along planned severing lines by a laser by introducing thermal stresses. The temperature gradient required for this and the compressive stresses and tensile stresses resulting from it are gener...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	ZUEHLKE HANS ULRICH,GRIEGER JAN,EBERHARDT GABRIELE
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING GLASS MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention is directed to a method in which disks, particularly wafers, of brittle material are severed along planned severing lines by a laser by introducing thermal stresses. The temperature gradient required for this and the compressive stresses and tensile stresses resulting from it are generated in that the disk is first cooled proceeding from its underside at least along the planned severing lines toward the upper side of the disk, and the upper side of the disk is then acted upon by a laser beam along the planned severing lines. The description also relates to an apparatus for carrying out the method.