Laser beam machining apparatus, its machining method, and mechanism and method for collecting debris

A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generate...

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Bibliographische Detailangaben
Hauptverfasser:	MURASE EIJU, ASO YUKINARI, YAMADA NAOKI, SASAKI YOSHINARI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.