Multi-chemistry plating system

Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YANG MICHAEL X.,XI MING,ELLWANGER RUSSELL C.,BRITCHER ERIC B.,DONOSO BERNARDO,PANG LILY L.,SHERMAN SVETLANA,HO HENRY,NGUYEN ANH N.,LERNER ALEXANDER N.,D. AMBRA ALLEN L.,SHANMUGASUNDRAM ARULKUMAR,ISHIK, KY DMITRY,MOK YEUK-FAI EDWIN,NGUYEN SON T
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.