Image sensing devices, image sensor modules, and manufacturing methods

The present invention discloses an imaging devices, and a manufacturing method thereof. The imaging device of the invention includes a carrier having a first surface, a second surface generally opposite the first surface, and carrier contacts. The carrier contacts are carried on the second surface of the carrier. The device further includes an electric deformable pad element, and an image sensor module having light sensing elements and a support. The support has a first surface, a second surface generally opposite the first surface, and support contacts. The support contacts are carried on the first surface of the support. The image sensor module is coupled to the first surface of the support and is located relative to the support to at least substantially face the second surface of the support. The electric deformable pad element is provided between at least a carrier contact and at least a support contact to couple at least a support contact to at least a carrier contact.