Semiconductor structure and its preparing process
The semiconductor junction includes a substrate, a weld pad, a fuse structure, and a protection layer. The substrate possesses weld pad section, and fuse section. Weld pad is collocated on substrate in weld pad section, and fuse structure is collocated on substrate in fuse section. The protection la...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The semiconductor junction includes a substrate, a weld pad, a fuse structure, and a protection layer. The substrate possesses weld pad section, and fuse section. Weld pad is collocated on substrate in weld pad section, and fuse structure is collocated on substrate in fuse section. The protection layer is collocated on substrate to cover weld pad section, and fuse structure in order to avoid oxidizing weld pad. |
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