Methods and apparatus for transferring substrates during electronic device manufacturing

In one aspect, a first apparatus is provided that is adapted to transfer a substrate between a transfer chamber and a processing chamber. The first apparatus includes a robot having a first blade, a second blade spaced from the first blade, and a central hub coupled to the first blade by at least a first arm and coupled to the second blade by at least a second arm. The first blade and the second blade are spaced so as to allow (a) both blades to simultaneously extend through a slit valve that separates a transfer chamber from a processing chamber coupled to the transfer chamber when the robot is positioned within the transfer chamber; and (b) the first and second blades to transfer substrates to and remove substrates from the processing chamber without raising or lowering the first and second blades or the robot. Numerous other aspects are provided.