Conductor-clad laminate, wiring circuit board, and processes for producing the same

In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150 DEG C. to thereby form an adhesive layer 2 . Subsequently, an insulating film 3 including a polyimide fil...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YAMUCHI DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!