Conductor-clad laminate, wiring circuit board, and processes for producing the same

Conductor-clad laminate, wiring circuit board, and processes for producing the same

In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150 DEG C. to thereby form an adhesive layer 2 . Subsequently, an insulating film 3 including a polyimide fil...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: YAMUCHI DAISUKE
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Beschreibung
Zusammenfassung:In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150 DEG C. to thereby form an adhesive layer 2 . Subsequently, an insulating film 3 including a polyimide film is laminated on the adhesive layer 2 at room temperature (about 25 DEG C.) to thereby produce a layered product 6 including the release film 1 , adhesive layer 2 and insulating film 3 . Next, the release film 1 is stripped from the layered product 6 and a conductor film 4 including a copper foil is laminated to the adhesive layer 2 to thereby produce a conductor-clad laminate 8.