Adhesives and electric devices

To provide an adhesive resin with high reliability for semiconductor chips. The adhesive 12 contains: a main resin component which is polymerizable, a main hardener for inducing a self-polymerization reaction of the main resin component and a second hardener which is addition-polymerized with the ma...

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Bibliographische Detailangaben
1. Verfasser:	TAKEICHI MOTOHIDE,KONISHI MISAO,SHINOZAKI JUNJI,AKUTSU YASUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	To provide an adhesive resin with high reliability for semiconductor chips. The adhesive 12 contains: a main resin component which is polymerizable, a main hardener for inducing a self-polymerization reaction of the main resin component and a second hardener which is addition-polymerized with the main resin component. When the adhesive 12 is applied on a wiring board 13 and a semiconductor chip 11 is applied thereon and heat is applied, the second hardener is addition-polymerized with the backbone of the three-dimensional network formed by the self-polymerization reaction of the main resin component. The first temperature at which the addition polymerization zone becomes a rubbery structure is lower than the second temperature at which the backbone becomes a rubbery structure, so that the elastic modulus loss sharply increases at the first temperature to reduce the stress between the semiconductor chip 11 and the wiring board 13.