Tin-based plating film and method for forming the same

A tin-based plating film with suppressed whisker growth is provided. The tin-based plating film has a two-layer structure comprising a lower layer formed of a tin plating film or tin alloy plating film comprising not more than 5% by weight of at least one metal selected from the group consisting of...

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Bibliographische Detailangaben
1. Verfasser:	KWOK CHUN WAH JIMMY,KWOK YIM WAH ROSALINE,NAKAGISHI YUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	A tin-based plating film with suppressed whisker growth is provided. The tin-based plating film has a two-layer structure comprising a lower layer formed of a tin plating film or tin alloy plating film comprising not more than 5% by weight of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver, and indium, and not less than 95% by weight of tin, and an upper layer formed of a tin plating film or tin alloy plating film comprising not more than 5% by weight of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver, and indium, and not less than 95% by weight of tin. The tin-based plating film is a lead-free tin plating film or tin alloy plating film and suppress the occurrence of whiskers for a long period of time, and, at the same time, can be relatively easily formed without a complicated process.