Printed circuit board and method for manufacturing the same
An embodiment of a printed circuit board according to the present invention is provided with an insulating layer, a conductive layer that is laminated on the insulating layer and that has a connecting portion and a circuit pattern portion formed connected to the connecting portion, and a film cover...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An embodiment of a printed circuit board according to the present invention is provided with an insulating layer, a conductive layer that is laminated on the insulating layer and that has a connecting portion and a circuit pattern portion formed connected to the connecting portion, and a film cover layer that covers the insulating layer and the conductive layer via an adhesive layer and that has an opening for connecting a mounted component to the connecting portion. The circuit pattern portion is provided with a recessed portion that is concave with respect to the connecting portion. |
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