Chip module made of multilayer circuit board
The invention relates to a chip module formed by multilayer circuit board, wherein it comprises the first circuit board, the second circuit board, and at least third circuit board; the first circuit board at least has one chip welding pad to mount chip; the second and third circuit boards have cuts...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention relates to a chip module formed by multilayer circuit board, wherein it comprises the first circuit board, the second circuit board, and at least third circuit board; the first circuit board at least has one chip welding pad to mount chip; the second and third circuit boards have cuts to expose the welding pad; the cut of third board is larger than the cut on second board; the second circuit board has platform above to mount inactive element; the invention can improve producing efficiency, with low cost. |
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