Radiator with heat conductor

A circuit assembly including a substrate which has a dielectric layer, a heat spreader layer located at a first surface of the substrate, a heat generating component located at a second surface of the substrate, and a thermal pathway in thermal connection between the heat spreader layer and the heat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	REIS BRADLEY E.,SMALE MARTIN D.,LASER BRIAN J.,KOSTYAK GARY S.,SKANDAKUMARAN PRATHIB,GETZ MATTHEW G.,FRASTACI MICHAEL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILSOF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENT DETAILS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A circuit assembly including a substrate which has a dielectric layer, a heat spreader layer located at a first surface of the substrate, a heat generating component located at a second surface of the substrate, and a thermal pathway in thermal connection between the heat spreader layer and the heat generating component.