Photonasty resin compositon
The invention provides a photosensitive resin composition being excellent in flatness after development, sensitivity, resolution, heat resistance, transparency, and the like; capable of reducing its electric power consumption, especially by realizing an organic insulation film having a low dielectri...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention provides a photosensitive resin composition being excellent in flatness after development, sensitivity, resolution, heat resistance, transparency, and the like; capable of reducing its electric power consumption, especially by realizing an organic insulation film having a low dielectric constant; capable of reducing crosstalk; and suitable for an organic insulation film in various display operations. SOLUTION: The photosensitive resin composition comprises: (a) an acrylic copolymer in which are copolymerized (i) a specific silsesquixane polyhedron oligomer-containing unsaturated compound, (ii) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture thereof, (iii) an epoxy group-containing unsaturated compound and (iv) an olefinic unsaturated compound; (b) a 1,2-quinone diazide compound; and (c) a solvent. Chemical formulas (1) and (2) are shown in the description. |
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