Photonasty resin compositon

The invention provides a photosensitive resin composition being excellent in flatness after development, sensitivity, resolution, heat resistance, transparency, and the like; capable of reducing its electric power consumption, especially by realizing an organic insulation film having a low dielectri...

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Bibliographische Detailangaben
1. Verfasser: RYO HAN-HEUN,KIM PYEONG-UK,YOUNG HYUG-MIN,KOO KEY-HYUG,YOUNG CHOO-BO,CHEONG YEOOL,KIM DONG-MEYONG,CHOI SAHNG-GYO,LEE KWANGIM,SIM HUN-DAE,LEE DONG-HEUCK
Format: Patent
Sprache:eng
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Zusammenfassung:The invention provides a photosensitive resin composition being excellent in flatness after development, sensitivity, resolution, heat resistance, transparency, and the like; capable of reducing its electric power consumption, especially by realizing an organic insulation film having a low dielectric constant; capable of reducing crosstalk; and suitable for an organic insulation film in various display operations. SOLUTION: The photosensitive resin composition comprises: (a) an acrylic copolymer in which are copolymerized (i) a specific silsesquixane polyhedron oligomer-containing unsaturated compound, (ii) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture thereof, (iii) an epoxy group-containing unsaturated compound and (iv) an olefinic unsaturated compound; (b) a 1,2-quinone diazide compound; and (c) a solvent. Chemical formulas (1) and (2) are shown in the description.