Process for forming a solder mask, apparatus thereof and process for forming electric-curcuit patterned internal dielectric layer

In a process for forming a solder mask, a photoimageable ink is coated on a carrier film to form a photoimageable ink layer on the carrier film. The photoimageable ink layer is dried to form a photoimageable resist layer, thereby forming at least one photoimageable resist layer bearing film. The photoimageable resist layer bearing film is laminated on at least one side of a substrate so as to bring the upper surface of the photoimageable resist layer into contact with the substrate. The photoimageable resist layer is exposed to light imagewise through the carrier film. The carrier film is removed from the photoimageable resist layer to form an exposed resist layer. The exposed resist layer is developed to form a developed resist layer. The developed resist layer is cured to form a solder mask on the substrate.