Cerium oxide abrasive and method of polishing substrates

A cerium oxide abrasive for abrading surfaces of an SiO2 insulating film or the like film without causing defects and at high speeds. The abrasive includes a slurry obtained by dispersing, in a medium, the cerium oxide particles having diameters of primary particles of from 10 to 600 nm, a median va...

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Bibliographische Detailangaben
Hauptverfasser:	TANNO KIYOHITO, TERESAKI HIROKI, OOTUKI YUUTO, ASHIZAWA TORANOSUKE, YOSHIDA MASATO, MATSUZAWA JUN, KURATA YASUSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INORGANIC CHEMISTRY MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NANOTECHNOLOGY NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING
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Beschreibung
Zusammenfassung:	A cerium oxide abrasive for abrading surfaces of an SiO2 insulating film or the like film without causing defects and at high speeds. The abrasive includes a slurry obtained by dispersing, in a medium, the cerium oxide particles having diameters of primary particles of from 10 to 600 nm, a median value of 30 to 250 nm, a median value of particle diameters of 150 to 600 nm, and a maximum diameter of not larger than 3000 nm.