Conductive material compositions, apparatus, systems, and methods

Various apparatus and systems, as well as methods and articles, may include the use of several compositions, such as solder formulations, including about 78%-83% by weight of lead, about 9%-11% by weight of antimony, about 1%-3% by weight of silver, and a balance of tin. Some embodiments include a p...

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Hauptverfasser:	HRAMETZ ANDREW ALBERT, DEEPAK JAMES CHRISTOPHER
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Various apparatus and systems, as well as methods and articles, may include the use of several compositions, such as solder formulations, including about 78%-83% by weight of lead, about 9%-11% by weight of antimony, about 1%-3% by weight of silver, and a balance of tin. Some embodiments include a process of removing a previously-existing lead finish, and applying a new finish to the lead to improve solder operation compatibility, as well as solder joint reliability in high temperature environments.