Printing plate, method of fabricating the same, and method of fabricating flat panel display using the same

A method of fabricating a printing plate includes: preparing a substrate; forming a metal layer on an entire surface of the substrate; forming a resist pattern on the metal layer, the resist pattern having a fine pattern exposing a portion of the metal layer; wet etching the exposed metal layer, and...

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Bibliographische Detailangaben
1. Verfasser:	YOO SOON S.,CHANG YOUN G.,CHO HEUNG L
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY LINING MACHINES MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM PRINTING PRINTING MACHINES OR PRESSES PRINTING PLATES OR FOILS PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES SEMICONDUCTOR DEVICES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A method of fabricating a printing plate includes: preparing a substrate; forming a metal layer on an entire surface of the substrate; forming a resist pattern on the metal layer, the resist pattern having a fine pattern exposing a portion of the metal layer; wet etching the exposed metal layer, and removing the resist pattern to form a metal layer pattern exposing a portion of the substrate; wet etching the exposed substrate, and removing the metal layer pattern to form a recessed pattern; and forming a compensation layer on an entire surface of the substrate where the recessed pattern is formed.