Soldering method

An object of the invention is to provide a high-quality soldering method, by reducing, to a vacuum, the pressure in a vacuum room ( 2 ) in which a workpiece ( 10 ) having solid solder placed thereon consisting solely of tin or including tin and one or more components selected from silver, lead, copp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	OHNO YASUHIDE,NAKAMORI TAKASHI,SUENAGA MAKOTO,TAKEUCHI TATSUYA,KAGAMI JOHJI,HAGIHARA TAIZO
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An object of the invention is to provide a high-quality soldering method, by reducing, to a vacuum, the pressure in a vacuum room ( 2 ) in which a workpiece ( 10 ) having solid solder placed thereon consisting solely of tin or including tin and one or more components selected from silver, lead, copper, bismuth, indium and zinc is disposed. A free-radical gas is generated to remove an oxide film on the solder, and, after that, the generation of the free-radical gas is stopped, and the temperature of the solder is raised to a temperature above the melting point of the solder to melt the solder in the non-oxidizing atmosphere.